TSMC recently announced the opening of its Advanced Backend Fab 6, the company's first fully automated advanced packaging and testing factory to perform 3DFabric front-end and back-end process integration and testing services.
The factory is prepared for mass production of the TSMC-SoIC (System on Integrated Chips) process technology. Advanced Backend Fab 6 enables TSMC to flexibly allocate capacity to TSMC 3DFabric advanced silicon packaging and stacking technologies such as SoIC, InFO, CoWoS and advanced testing, improving production yield and efficiency.
Construction of Advanced Backend Fab 6 began in 2020 to support the next generation of HPC, AI, mobile applications and other products, and help customers achieve product success and capture market opportunities.
Located in Zhunan Science Park, the factory has a base area of 14.3 hectares, making it TSMC's largest advanced back-end factory to date, with a clean room area larger than the sum of other factories TSMC's advanced backend systems. TSMC estimates that the fab will have the capacity to produce more than one million 12-inch wafer-equivalent 3DFabric process technology per year and more than 10 million hours of test services per year.
“Chip stacking is a key technology for improving the performance and cost-effectiveness of chips. In response to strong market demand for 3D IC, TSMC has completed the initial deployment of advanced packaging and silicon stacking technology production capacity and provides technology leadership through the 3DFabric platform,” said Dr. and Quality and Reliability. “With production capacity that meets our customers’ needs, we will unleash innovation together and become an important partner that customers trust in the long term.”
TSMC uses smart manufacturing to optimize factory production efficiency. The factory-integrated five-in-one intelligent automatic material handling system has a total length of more than 32 kilometers.
From wafer to die, production information is connected to agile dispatch systems to shorten the production cycle. These systems are combined with artificial intelligence to simultaneously perform precise process control, detect abnormalities in real time, and establish a robust matrix-level big data quality defense network. The data processing capacity per second is 500 times that of a front-end factory, and a complete production history for each die is built through die traceability.
