Texas Instruments (TI), a provider of high-voltage semiconductor solutions, announced that Chicony Power has engineered TI's integrated Gallium Nitride (GaN) technology to power its latest 65W Le Petit laptop power adapter. .
Leveraging TI's half-bridge GaN FET with integrated gate driver, LMG2610, Chicony Power and TI collaborated on a project to reduce the size of Chicony's power adapter by 50% and increase efficiency by up to 94%.
As a power supply supplier committed to improving power conversion efficiency in electronic power projects, Chicony Power has worked closely with international IC companies, providing them with the market and technical requirements to help develop solutions in new projects.
For the design of the Le Petit laptop adapter, Chicony Power teamed up with TI for its expertise in high voltage design and its integrated GaN technology. TI's LMG2610 is designed to be paired with the UCC28782 active clamp flyback (ACF) controller to create an easy-to-use, high-efficiency, high-power-density solution for AC/DC designs below 75W.
Improving energy conversion efficiency
Increasingly, consumers are looking for smaller and lighter electronic products, while also wanting to reduce their energy footprint. In the laptop power adapter market, this has challenged engineers to find new ways to pack more power into smaller spaces while minimizing power loss to provide more efficient adapters.
Chicony Power and TI were able to miniaturize the power adapter design and reduce the use of mechanical materials by 40% by leveraging TI's LMG2610 GaN FET, which integrates top and bottom switches, gate driver IC, level shifter and bootstrap circuits into a single chip, as well as Chicony Power's 3D structure, component miniaturization, heat dissipation system, and electromagnetic interference (EMI) suppression design expertise. Le Petit has a compact size of 49 cm3, slightly larger than a typical ice cube, with a power supply conversion efficiency of up to 94% compared to the 89% efficiency achieved by typical power adapters using materials of silicon.
“Our collaboration with Chicony Power is an example of how TI products help make electronics smaller, more energy efficient and more reliable,” said Lucas Lee, TI vice president for Asia and president for Taiwan, Korea and South from Asia . “Our highly integrated GaN technology enables power adapters with improved thermal performance and energy efficiency while delivering high power density with fewer components.”
“Chicony is committed to corporate social responsibility and has been implementing the Responsible Business Alliance (RBA) code of conduct for many years,” added Winson Huang , chief purchasing officer at Chicony Power. “Collaborating with TI to develop a new generation of power adapters will not only provide consumers with lighter and more convenient devices compared to other 65W adapters on the market, but also leverage the advantages of both parties to jointly create more energy. efficient products.”
Thermal and EMI Challenges
In addition to the power efficiency and size advantages provided by TI's integrated GaN technology, the UCC28780 and UCC28782 flyback controllers support high-frequency zero-voltage switching (ZVS) design.
By combining these advantages with Chicony Power's power design expertise, Chicony Power's designers were able to overcome the temperature rises and increased EMI typically caused by higher frequency power in lightweight power supplies and effectively reduced the size from the power adapter while maintaining temperature and performance control. .
