Nexperia announced that it is now offering a portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. portfolio includes 11 industrial products as well as 11 AEC-Q101 qualified products. This release supports the growing trend of manufacturers to replace devices in SMx packaging with smaller CFP-packaged devices, especially in automotive applications. These diodes are suitable for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR applications.
For maximum design flexibility, device options in this portfolio are offered with reverse voltages V R(max) ranging from 30 V to 100 V and forward currents I F(average) between 1 A and 3 A. The exposed heat sink, which is a feature of the CFP3-HP, allows it to provide the highest level of heat dissipation ( small P) for a package with such small dimensions (3.7mm x 1.8mm x 0.9mm).
Utilizing the proprietary copper clip design, these packages meet the challenging demands for efficient, space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia's Schottky and recovery rectifiers, but can also be extended to bipolar transistors. It offers significant product diversity. This further solidifies Nexperia's position as a leader in packaging innovation, offering customers the broadest range of device options from a semiconductor manufacturer with a reliable supply chain.
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