Vehicles with fully or partially electrified drivetrains will account for two-thirds of cars produced by 2028, according to analyst forecasts. This rapid growth in electromobility is driving demand for power semiconductors.
In this context, Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will supply chipsets consisting of IGBTs and diodes to Semikron Danfoss. These chips are mainly used in power modules for inverters, which are used for main drive of electric vehicles.
“As a global leader in automotive semiconductors, Infineon offers revolutionary solutions for clean and safe mobility. Already today, our IGBTs and diodes play an important role in transforming industry electromobility by enabling efficient energy conversion in the electric powertrain,” said Peter Schiefer, president of Infineon’s automotive division. “Our broad product portfolio, systems expertise and continued investment in our manufacturing capabilities make us a valued partner of automotive players like Semikron Danfoss.”
The IGBTs and diodes for Semikron Danfoss will be manufactured by Infineon at its sites in Dresden, Germany, and Kulim, Malaysia. Semikron Danfoss manufactures its own automotive power modules in Nuremberg and Flensburg, Germany, in Utica, USA, and from next year in Nanjing, China.
“Semikron Danfoss provides automotive customers with power modules based on the most advanced assembly technologies that fully exploit the capabilities of IGBTs and diodes to enable further decarbonization of the transportation sector,” added Claus A. Petersen, President of Semikron Danfos. “Automotive customers trust us as an experienced, long-term partner to drive industry transformation.”
