Texas Instruments (TI) has expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on TI's decades of wireless connectivity experience.
Engineers can meet form factor requirements and deploy smart designs anywhere with power-efficient processors.
“Industry-wide, five billion Bluetooth-enabled devices are predicted to ship in 2022,” said Mark Powell , CEO of the Bluetooth Special Interest Group (SIG), the standards organization that oversees Bluetooth technology. “The commitment and involvement of Bluetooth SIG members like Texas Instruments enables Bluetooth technology to meet the growing demands for enhanced wireless connectivity across a wide range of applications. I am grateful for our members’ contributions in providing innovative solutions that benefit the Bluetooth ecosystem and help expand the adoption of Bluetooth technology.”
TI will demonstrate the CC2340 wireless MCUs at booth #3A-215 at Embedded World in Nuremberg, Germany , June 21-23, 2022 .
“Bluetooth LE adoption is accelerating and our worldwide integrated demonstration of the CC2340 family will show how to quickly and easily add the technology to any application,” said Marian Kost , vice president and general manager of connectivity at Texas Instruments. “The new MCUs will deliver high-quality RF and power performance at an affordable price, backed by unmatched technical support and investments in in-house manufacturing capacity that will help meet our customers’ demand for years to come.”
The CC2340R2 and CC2340R5 wireless MCUs, offering 256 KB and 512 KB flash memory respectively, offer exceptional flexibility for engineers and ample space for application code. Additionally, with the proliferation of Bluetooth LE applications, designers need additional memory capacity to easily update software remotely. The new wireless MCU family features 36 KB of RAM with over-the-air download support.
The new MCUs include a standby current of less than 830 nA, which is 40% lower than competitive devices. The reduction in standby current helps extend battery life by up to 10 years in a coin cell battery in wireless applications such as electronic shelf tags and tire pressure monitoring systems. The CC2340 family also features an operating temperature range of –40º to 125º C to help ensure a stable connection in all applications, from industrial sensors and medical laboratories to outdoor environments such as electric vehicle chargers or smart meters.
Engineers are also able to expand RF performance and connection range with output power of up to +8 dBm, the highest in the industry among competing Bluetooth LE wireless MCUs. Additionally, CC2340 devices feature an integrated RF balun to enable a simpler design with fewer external components, resulting in cost savings.
With greater memory, longer battery life, and greater temperature range at an affordable price, engineers can enable more connected everyday applications such as:
- Medical devices: In glucose meters, for example, the CC2340 MCUs' standby current of less than 830 nA leads to a final product life of 18 to 24 months and two weeks of active Bluetooth LE operation on a cell-type battery. coin.
- Building Automation: Smart home hubs can take advantage of CC2340 MCUs' wireless protocol support and output power range of up to +8 dBm.
- Personal Care: For products such as electric toothbrush, CC2340 wireless MCUs offer low power consumption in standby mode and can extend battery life.
In this week's Embedded World, visitors to the TI booth can use the SimpleLink CC2340 LaunchPad development kit to establish a Bluetooth LE connection in two minutes or less. Throughout the show, TI will demonstrate how its products can help engineers overcome AI, connectivity and automotive design challenges.
To view virtual demos and related white papers, technical articles, and on-demand training, see TI.com/embeddedworld.
