Texas Instruments ( TI ) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packaging for a wide range of missions.
TI has developed a new device screening specification called Space High Grade Plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification.
TI also introduced new product families into the radiation-tolerant Space Enhanced Plastic (Space EP) portfolio. Compared to traditional ceramic packaging, plastic packaging takes up less space, which allows designers to reduce system size, weight and power, helping to reduce launch costs.
In the past, space applications and programs have used hermetically sealed ceramic Qualified Manufacturers List (QML) Class V devices to ensure reliability. Today, applications like New Space, designed to increase commercial access to space programs through short-term missions in low Earth orbit (LEO), are helping to expand communication and connectivity.
For new space applications, there is a growing need for smaller components that help reduce system size and weight — and therefore reduce the cost required to launch an application into space. Plastic substrate spherical grid array (PBGA) and plastic-encapsulated devices offer an alternative to traditional space semiconductor packages.
Greater bandwidth in a smaller size
TI's SHP specification indicates integrated circuits (ICs) that meet the rigorous design requirements of deep space missions with extremely harsh environmental conditions. The SHP specification includes PBGA and plastic-encapsulated packages for radiation-hardened semiconductors.
The 10 x 10 x 1.9 mm ADC12DJ5200-SP and ADC12QJ1600-SP ADCs in BGA SHP flip-chip packages are TI's first products that meet SHP specifications. These ADCs help enable designs up to seven times smaller than those using equivalent ceramic devices, maximize data communication speeds with SerDes rates of up to 17.1 Gbps, and reduce thermal resistance.
Learn more about TI's SHP specifications by reading “How SHP in Plastic Packaging Addresses Three Key Design Challenges for Space Applications.”
Save board space for new space missions
TI's Space EP portfolio is the industry's largest radiation-tolerant plastic signal chain and power management portfolio, with devices designed specifically for smaller, high-volume LEO satellite applications. Space EP devices can help save up to 50% board space compared to traditional ceramic packages and provide high-performance power supplies with rail-to-rail input/output operation.
The TPS7H5005-SEP family of pulse-width modulation (PWM) controllers are the newest products in TI's Space EP portfolio and support multiple power supply topologies and field-effect transistor (FET) architectures. TPS7H5005-SEP PWM controllers minimize power loss through synchronous rectification, enabling at least 5% greater power efficiency compared to equivalent devices.
With more than 60 years in the space market, TI continues to develop rugged, radiation-tolerant products and packaging that enable designers to meet critical mission requirements with increased power density, performance capabilities and reliability.
Learn more about TI's Space EP products by reading the application note, “Reduce Risk on Low Earth Orbit Missions with Space-Enhanced Plastic Products.”