Samsung Electronics, a global provider of advanced memory technology, announced that it has developed the industry's first and highest capacity 32 gigabit (Gb) DDR5 DRAM using 12 nanometer (nm) class process technology. This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung's leadership in next-generation DRAM technology and signals the next chapter of high-end memory. capacity.
“With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1 terabyte (TB), allowing us to be ideally positioned to meet the growing need for high-capacity DRAM in the age of AI. Artificial) and big data,” said SangJoon Hwang, executive vice president of DRAM product and technology at Samsung Electronics. “We will continue to develop DRAM solutions through differentiated processes and design technologies to break the boundaries of memory technology.”
Increasing DRAM Capacity
Having developed its first 64 kilobit (Kb) DRAM in 1983, Samsung has now managed to increase its DRAM capacity by a factor of 500,000 over the last 40 years.
Samsung's newest memory product, developed using cutting-edge processes and technologies to increase integration density and design optimization, features the industry's largest capacity for a single DRAM chip and offers twice the capacity of 16Gb DDR5 DRAM in the same package size.
Previously, 128GB DDR5 DRAM modules manufactured with 16Gb DRAM required the Through Silicon Via (TSV) process. However, by using Samsung's 32GB DRAM, the 128GB module can now be produced without using the TSV process, while reducing power consumption by approximately 10% compared to 128GB modules with 128GB DRAM. 16 Gb. This technological advancement makes the product the ideal solution for companies that emphasize energy efficiency, such as data centers.
With its 12nm-class 32Gb DDR5 DRAM as the foundation, Samsung plans to continue expanding its high-capacity DRAM lineup to meet the current and future demands of the computing and IT industry. Samsung will reaffirm its leadership in the next-generation DRAM market by providing 12nm-class 32Gb DRAM to data centers as well as customers requiring applications such as AI and next-generation computing. The product will also play an important role in Samsung's ongoing collaboration with other key industry players.
Mass production of the new 12nm class 32Gb DDR5 DRAM is scheduled to begin later this year.