Portfólio SECORA Pay agora disponível em tecnologia de chip de 28 nm

SECORA Pay portfolio now available in 28nm chip technology

Infineon Technologies expands its portfolio of SECORA Pay solutions to 28nm technology. With this, the company further pushes the boundaries of payment cards with new and innovative product designs. Furthermore, it also offers the latest technology as a reliable sourcing option for all regional payments ecosystems.

The new product family is the first of its kind on the market to utilize 28nm chip technology with built-in non-volatile memory. The goal is to alleviate the pain the payments industry has been facing due to semiconductor shortages in mature technology nodes.

“In recent years, the touchless payment experience with dual-interface payment cards has become a global standard, among others also driven by the COVID-19 pandemic,” said Tolgahan Yildiz, Head of Payment Solutions, Systems Division Infineon Connected Insurance. “The SECORA Pay solution portfolio is tailored to enable the manufacturing and issuance of high-quality dual-interface payment cards and delivers the highest transaction performance with reliable security for reliable and seamless payments.”

The global dual-interface payment card market is expected to grow at a compound annual growth rate of 6% between 2022 and 2027, from an estimated 2.6 billion units in 2022.

Infineon's new plug-and-play solutions offer a simple integration and migration path for card manufacturers. They are backward compatible with existing SECORA Pay product offerings in terms of card production, antenna design, personalization and product certification. Additionally, the devices offer contactless performance and personalization, enabling contactless transactions in as little as 155 ms.

The product family uses a security controller with certified software integrated into Coil on Module (CoM) chip modules and uses standardized inlays for easy and fast production of cards compatible with SECORA Pay products in 65, 40 and
28 nm technology — a built-in sheet adapts to the already available and the new generation SECORA Pay.

The CoM system offers maximum flexibility in card design, as Infineon uses inductive coupling technology in combination with copper wire card antennas. It is ideal for future market trends such as eco-friendly cards made from ocean-bound recycled plastic or wood, as well as high-performance dual-interface metal or LED cards.

Furthermore, SECORA Pay solutions support the highest yield in card production with minimal resources for manufacturing highly robust dual interface cards. This makes contactless payment technology itself resource-efficient. New value-added services based on SECORA Pay's NFC tag functionality enable other use cases such as initial card activation and authentication for online banking and loyalty programs.

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