Infineon Technologies AG, in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies, is launching the IRS2975C image sensor – a performance-enhancing evolution of the IRS2875C.
The imager works according to the Time-of-Flight (ToF) principle, known as Indirect ToF (i-ToF), and is the industry's first based on Infineon's latest advancements in pixel technology. Both the form factor and performance of the IRS2975C are adapted to growing spot iToF applications, offering the widest possible operating range with an optimal power budget.
The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones and various IoT devices.
Infineon's latest pixel technology includes advanced 3D field engineering, enabling the best demodulation efficiency. Furthermore, a buried optical reflector raises quantum efficiency (QE) to a level hitherto achieved only by back-illuminated sensors (BSI), while maintaining the cost advantage of front-illuminated sensors (FSI).
Combined with the IRS9102C VCSEL driver, the IRS2975C reduces the bill of materials for camera modules and provides differentiating features for the high-volume smartphone segment.
The IRS2975C features a half-quarter video graphics matrix (HQVGA) resolution of 240 x 180 pixels with an industry-defining chip size of 18mm2 for a 1/6″ image circle. It offers high-sensitivity 10 µm pixels with SBI and enables highly integrated systems with low-power operation.
The imager is designed to support 2.8 volt power rails. Additionally, the device offers full laser safety functionality, such as unique eye protection mechanisms, and offers high flexibility in customizing use cases and output power.