Designing systems for the intelligent edge has never been more difficult. The windows on the market are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are dual priorities, and the need for security from start to finish continues to grow.
Meeting these simultaneous demands requires immediate knowledge of special technology and experience in vertical markets. There is no time to start from scratch.
Today, Microchip Technology adds nine new technology and application-specific solution stacks to its growing collection of mid-range FPGA and System-on-Chip (SoC) support. The stacks span the industrial edge, intelligent integrated vision, and edge communications.
“We’re making it much easier to create industry-leading industrial and communications designs,” said Shakeel Peera, vice president of strategy for Microchip’s FPGA business unit. “And our focus on the intelligent edge is gaining significant traction with leading system designers as they gain the full benefit of the PolarFire FPGA’s unmatched power efficiency, security and reliability.”
News of Microchip's expanded collections of solution stacks follows the announcement in June of an industrial edge stack for OPC/UA (Open Platform Communications/Unified Architecture) and extensive capabilities to help customers move to FPGAs and PolarFire SoCs.
“Size, weight and power are extremely important considerations in the design of a thermal imaging system,” said Federic Aubrun, CCO at Xenics, a pioneer in infrared imaging with best-in-class products for short, medium and long wave infrared. image generators, cores and cameras. “Microchip’s SmartFusion and PolarFire FPGAs provide the best balance of small form factor, power efficiency and processing capabilities with an extremely low power budget in our current and next-generation products.”