MediaTek announced that it has successfully developed its first chip using TSMC's 3nm technology – recording MediaTek's flagship Dimensity System (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC.
Both companies are leveraging their chip design and manufacturing strengths to jointly create flagship SoCs with high performance and low power consumption capabilities, powering global end devices.
“TSMC's consistent, high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and improving the user experience in the flagship market,” he said Joe Chen, President of MediaTek
TSMC's 3nm process technology delivers improved performance, power and throughput (plus full platform support) for high-performance computing and mobile applications.
Compared to TSMC's N5 process, TSMC's 3nm technology currently offers up to 18% speed improvement at the same power, or 32% power reduction at the same speed, and approximately 60% increase in logic density.
MediaTek's Dimensity SoCs, built on process technology, are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence and multimedia. MediaTek's first flagship chipset using TSMC's 3nm process is expected to power smartphones, tablets, smart cars and various other devices starting in the second half of 2024.
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as affordable as the smartphone in your pocket,” said Dr. Cliff Hou, Vice President senior sales officer in Europe and Asia at TSMC. “Over the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and we are honored to continue our partnership into the 3nm generation and beyond.”