The design of future power electronic systems is continually driven to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies has launched a new PQFN Source-Down 3.3 x 3.3 mm² product family in 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants.
The new product family offers significant improvements at the component level to deliver compelling solutions in DC-DC power conversion, opening new possibilities for system innovation in server, telecommunications, OR, battery protection, power tool and charger applications.
The new portfolio combines Infineon's latest MOSFET technology with high-quality packaging to take system performance to the next level. In the Source-Down (SD) concept, the source contact of the MOSFET array is turned toward the footprint side of the package, which is then soldered to the PCB. Additionally, the concept comprises an improved clip design on top of the chip for drain contact and chip-to-package area ratio.
As system form factors continually shrink, two key aspects are essential: reduced power losses and optimal thermal management. Compared to the best 3.3 x 3.3 m² PQFN drainage devices, the new family significantly improves resistance (R DS(activated) ) by up to 25%.
Infineon's OptiMOS Source-Down PQFN with Dual-Side Cooling provides an improved thermal interface to redirect power losses from the switch to the heatsink. Dual-side-cooled variants offer the most direct way to connect a power switch to a heatsink, increasing power dissipation capacity by a factor of up to three compared to the corresponding bottom-side-cooled supply variant.
Two different footprint variants are available to offer the highest flexibility for PCB routing. A traditional Standard-Gate variant provides quick and easy modification of existing Drain-Down designs. And a Center-Gate (CG) variant opens up new possibilities for paralleling devices to keep the driver-gate connection as short as possible.
With an excellent continuous current capacity of up to 298 A, the entire OptiMOS Source-Down PQFN 3.3 x 3.3 mm² 25-150 V product family enables the highest system performance.
