With the growing number of mobile devices, notebooks and battery-powered equipment, the need for greater charging power and fast charging has arisen. For engineers, this trend presents the challenge of achieving increasingly higher power levels in smaller form factors while meeting thermal performance requirements.
To meet these contemporary design needs, Infineon Technologies combines Hybrid Flyback (HFB) Controller, XDP Digital Power Controller XDPS2201 and CoolGaN Integrated Power Stage (IPS) 600V (IGI60F1414A1L) for high power density and adapter designs.
Anker chose Infineon's next-generation HFB controller and CoolGaN IPS for fast chargers above 100W, achieving market-leading power density.
“By combining Infineon’s hybrid flyback controller with an integrated CoolGaN device in Anker’s new charging lineup, we have achieved outstanding system-level efficiency in excess of 95 percent,” said Adam White, president of the power systems and sensors division. from Infineon. “This architecture reduces energy loss by 21% compared to other charging solutions. It is the first time that Infineon’s HFB controller and CoolGaN IPS devices are combined and applied commercially in the consumer electronics market.”
Anker Innovations is a global charging technology provider and developer of unique consumer electronics that support premium audio, mobile entertainment and the emerging smart home space.
“GaN has completely changed the way we charge our electronics, offering superior power transfer efficiency, faster charging speeds and better portability for our chargers,” added Steven Yang, CEO of Anker Innovations.
