Infineon Technologies is launching its next-generation XENSIV MEMS microphones that set a new industry standard. The IM69D127, IM73A135 and IM72D128 microphones are the latest additions to Infineon's growing microphone portfolio.
Combined with selectable power modes, MEMS microphones are the perfect match for consumer electronics such as active noise canceling headphones, TWS headphones, beamforming capable conferencing devices, laptops, tablets, or loud -smart speakers with voice user interfaces.
Use cases also include select industrial applications such as predictive maintenance and security.
The microphones are designed to capture audio signals with the highest precision and quality and are based on Infineon's latest MEMS Sealed Dual Membrane (SDM) technology, which offers high input protection (IP57) at the microphone level. The sealed MEMS design prevents water or dust from entering between the membrane and backplate, preventing mechanical blockage or electrical leakage issues commonly seen in MEMS microphones.
Additionally, microphones built using SDM technology can be used to create IP68 devices with the highest protection class, requiring only minimal mesh protection.
The IM73A135 analog microphone features a best-in-class signal-to-noise ratio (SNR) of 73 dB(A) and an excellent acoustic overload point (AOP) of 135 dB SPL (sound pressure level). Its digital counterpart, the IM72D128, offers an SNR of 72 dB(A) and an AOP of 128 dB SPL.
The IM69D127 features similar performance condensed into a tiny 3.60 x 2.50mm 2 package size. Furthermore, all devices feature extremely low distortion (THD) even at high sound pressure levels, close interpart phase and sensitivity matching, as well as a flat frequency response with a low FRO (low frequency roll-off) , an ultra-low group delay and selectable power modes.