Infineon Technologies is adding the AIROC CYW20820 Bluetooth and Bluetooth LE (Low Energy) system-on-chip (SoC) to its AIROC Bluetooth portfolio.
The AIROC CYW20820 Bluetooth and Bluetooth LE SoC is a Bluetooth 5.2 core specification compliant device tailored for IoT applications. It is designed to support a wide range of use cases for home automation and sensors – including medical, residential, security and industrial, as well as lighting, Bluetooth Mesh or any IoT application that needs Bluetooth LE or Bluetooth mode connectivity. double.
The AIROC CYW20820 Bluetooth and Bluetooth LE SoC provides reliable connectivity and low power consumption with high-performance computing capability by integrating an ARM Cortex-M4 microcontroller unit with a floating point unit. It is a highly integrated device with multiple digital interfaces, an optimized memory subsystem and a power amplifier that provides transmit output power of up to 11.5 dBm in LE and BR (base rate) modes, reducing device footprint and the costs associated with implementing Bluetooth solutions. .
Infineon is also adding to its extensive AIROC Bluetooth module portfolio with three modules that include an integrated crystal oscillator, passive components and the AIROC CYW20820 system-on-chip. These highly integrated modules are globally certified to support rapid market launch of IoT devices. AIROC modules CYBT-243053-02, CYBT-253059-02 and CYBT-243068-02 are supported by ModusToolbox software and tools with code examples to support rapid development of Bluetooth applications.
“The AIROC CYW20820 Bluetooth, Bluetooth LE SoC and modules are important additions to our portfolio and provide a low-power, cost-effective solution with scalable performance. With certified AIROC modules, Infineon is handling key Bluetooth design steps to enable customers the fastest path to market,” said Sonal Chandrasekharan, Vice President of Bluetooth Product Line at Infineon.