MediaTek announced the Dimensity 9000+, an enhancement to the company's 5G chipset for high-end smartphones. This new next-generation offering delivers a performance boost over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.
The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4nm octa-core process, combining an ultra-Cortex-X2 core operating at up to 3.2GHz (compared to 3. 05 GHz with Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor integrated into the new chipset provide an increase of more than 5% in CPU performance and an improvement of more than 10% in GPU performance.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures device makers always have access to the most advanced high-performance features and latest mobile technologies, enabling their top-tier smartphones to stand out, ” said Dr. Yenchi Lee, deputy general manager of MediaTek's wireless communications business unit. “With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
The Dimensity 9000+ is the latest addition to the Dimensity 9000 series of smartphone chipsets, designed for the growing bandwidth demands of the mobile market. The integrated LPDDR5X supports 8MB L3 CPU cache and 6MB system cache. Additionally, the chipset integrates MediaTek's fifth-generation Application Processor Unit (APU 5.0) for powerful AI computing capabilities in a low-power design.
Key features of the MediaTek Dimensity 9000+ include:
- MediaTek Imagiq 790 : The flagship 18-bit HDR-ISP supports 320 MP as well as simultaneous triple-camera 18-bit HDR video recording. The powerful 9 Gpixel/s ISP also supports 4K HDR video + AI noise reduction that enables the highest quality results even in low-light scenarios.
- Leading 3GPP Release-16 5G Modem : Integrated 5G modem amplifies sub-6GHz performance in downlink up to 7Gbps using 3CC (300MHz) carrier aggregation and supports R16 UL enhancement. The Dimensity 9000+ also integrates 5G/4G Dual SIM Dual Active support and MediaTek's 5G UltraSave 2.0 power-saving enhancement suite for greater efficiency.
- MediaTek MiraVision 790 : The Dimensity 9000+ supports the latest 144Hz WQHD+ displays or super-fast 180Hz FullHD+ displays, while optimizing power efficiency with MediaTek's Intelligent Display Sync 2.0 technology. Additionally, MediaTek's latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
- Wi-Fi 6E, new GNSS with Beidou III-B1C and new Bluetooth 5.3 : Smartphone users can enjoy seamless connectivity thanks to the chip's support for the latest Wi-Fi, Bluetooth and GNSS standards.
MediaTek Dimensity 9000+-powered smartphones are expected to launch in the third quarter of 2022.