announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th edition. º European Conference on Optical Communication (ECOC 2023).
The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively provide 800G and 1.6T pluggable modules and meet growing bandwidth needs and low power requirements of hyperscale data centers.
Sian BCM85822 Features
- Monolithic 5nm 800G (8:4) PAM-4 DSP with integrated laser driver
- Provides best module performance in BER and power consumption
- Proven interoperability with Broadcom's EML 200G
- Compatible with all IEEE and OIF standards, capable of supporting on-chip MR links to module electrical interface
- Supports optical modules from 800G to 1.6T
- Supports IEEE compliant Hamming internal code (128.120)
Given the increasing bandwidth demands of AI-driven workloads in hyperscale data centers, deploying 1.6T OSFP-XD transceiver modules would double bandwidth capacity per 1RU without changing existing infrastructure.
The BCM85822 is optimized for the 1.6T OSFP-XD transceiver module design and would effectively enable 51.2T switching capacity in a 1RU rack to improve bandwidth density in hyperscale data centers. Additionally, the adoption of 200G/lane optical interfaces lays the groundwork for the eventual deployment of 1.6 and 3.2T solutions with 200G/lane electrical interfaces — which are necessary for cloud providers to support next-generation switches and scale AI workloads.
“This latest generation of DSP operating at 200G/lane extends Broadcom’s leadership in high-bandwidth PHY and enables the industry’s lowest power optical modules,” said Vijay Janapaty, General Manager and Vice President, Broadcom Products Division. Broadcom's physical layer. “This, in turn, lays the foundation for next-generation switching platforms for AI/ML clusters and networks.”
For more information on how Broadcom's 200G/lane optical solutions power next-generation networks, read the Broadcom blog here.