STMicroelectronics announced an all-in-one direct 3D Time-of-Flight (dToF) LiDAR (Light Detection And Ranging) module with industry-leading 2.3k resolution. They revealed an early design win for the world's smallest 500k pixel indirect Time-of-Flight (iToF) sensor.
The announced VL53L9 is a new direct ToF 3D LiDAR device with resolution of up to 2,300 zones. Integrating a unique dual-scan flood lighting on the market, LiDAR can detect small objects and edges and capture 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low-power module with on-chip dToF processing, requiring no extra external components or calibration. Additionally, the device offers state-of-the-art performance ranging from 5 cm to 10 meters.
The VL53L9's feature set elevates the camera's assistive performance, supporting macro to telephoto photography. It enables features like laser autofocus, bokeh, and cinematic effects for photos and videos at 60 fps (frame per second). Virtual reality (VR) systems can leverage accurate depth and 2D imagery to enhance spatial mapping for more immersive games and other VR experiences, such as virtual tours or 3D avatars. Furthermore, the sensor's ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality or SLAM (simultaneous localization and mapping).
ST is also announcing news about its VD55H1 ToF Sensor, including the start of volume production and an early design win with Lanxin Technology, a China-based company focused on deep vision systems for mobile robots. MRDVS, a subsidiary company, chose the VD55H1 to add high-precision depth sensing to its 3D cameras. Ultra-compact, high-performance cameras with internal ST sensor combine the power of 3D vision and cutting-edge AI, providing intelligent obstacle avoidance and high-precision docking in mobile robots.
In addition to machine vision, the VD55H1 is ideal for 3D webcams and PC applications, 3D reconstruction for VR headsets, people counting, and activity detection in smart homes and buildings. It contains 672 x 804 sensing pixels on a tiny chip and can accurately map a three-dimensional surface by measuring distance in more than half a million points. ST's back-illuminated stacked wafer manufacturing process enables unparalleled resolution with a smaller die size and lower power consumption than alternative iToF sensors on the market. These characteristics give the sensors excellent credentials in creating 3D content for webcams and VR applications, including virtual avatars, hand modeling and gaming.
The first samples of the VL53L9 are now available to major customers and mass production is scheduled for early 2025. The VD55H1 is in full production now.
Pricing and sample ordering information is available from your local ST sales offices.
ST will showcase a range of ToF sensors, including the VL53L9, and explain more about its technologies at Mobile World Congress 2024 in Barcelona, February 26-29, at stand 7A61.
